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HUAWEI BSC6000 基站控制器
系统结构与原理  目   录

目   录
总体结构.......................................................................................................................................1-1
1.1 硬件结构......................................................................................................................................................1-2
1.1.1 概述....................................................................................................................................................1-2
1.1.2 机柜....................................................................................................................................................1-5
1.1.3 GIMS...................................................................................................................................................1-6
1.1.4 插框....................................................................................................................................................1-7
1.1.5 单板..................................................................................................................................................1-10
1.2 App结构....................................................................................................................................................1-11
1.2.1 主机App..........................................................................................................................................1-11
1.2.2 操作维护App...................................................................................................................................1-12
1.3 逻辑结构....................................................................................................................................................1-12
1.3.1 概述..................................................................................................................................................1-12
1.3.2 TDM交换子系统..............................................................................................................................1-13
1.3.3 GE交换子系统.................................................................................................................................1-13
1.3.4 业务处理子系统...............................................................................................................................1-13
1.3.5 业务控制子系统...............................................................................................................................1-13
1.3.6 接口和信令处理子系统...................................................................................................................1-14
1.3.7 时钟子系统......................................................................................................................................1-14
1.3.8 操作维护子系统...............................................................................................................................1-14
1.3.9 环境监控子系统...............................................................................................................................1-14
TDM交换子系统.........................................................................................................................2-1
2.1 硬件结构......................................................................................................................................................2-2
2.2 逻辑结构......................................................................................................................................................2-2
2.2.1 概述....................................................................................................................................................2-2
2.2.2 TDM交换单元....................................................................................................................................2-4
2.2.3 TDM接入承载单元............................................................................................................................2-5
2.2.4 TDM处理承载单元............................................................................................................................2-6
GE交换子系统.............................................................................................................................3-1
3.1 硬件结构......................................................................................................................................................3-2
3.1.1 硬件实体............................................................................................................................................3-2
文档版本 02 (2007-02-06)  HUAWEI技术有限企业  i